Galeria de Modelos

A Galeria de Modelos possui arquivos do COMSOL Multiphysics de várias áreas de aplicação incluindo elétrica, mecânica, escoamento e química. Você pode baixar modelos prontos e também tutoriais passo-a-passo para montar seu modelo, e usá-lo como ponto de partida para o seu próprio modelo. Use a função de busca "Quick Search" para encontrar modelos na sua área de interesse e faça o login ou o seu cadastro no COMSOL Access, cadastrando a sua licença do COMSOL, para poder baixar os arquivos.

Fluid-Structure Interaction

This model demonstrates how to set up a fluid-structure interaction problem in COMSOL Multiphysics. It illustrates how fluid flow can deform solid structures and how to solve for the flow in a continuously deforming geometry. The Fluid-Structure Interaction (FSI) multiphysics interface combines fluid flow with solid mechanics to capture the interaction between the fluid and the solid structure. ...

Electrostatically Actuated Cantilever

The elastic cantilever beam is one of the elementary structures used in MEMS designs. This model shows the bending of a cantilever beam under an applied electrostatic load. The model solves the deformation of the beam under an applied voltage.

Piezoelectric Shear-Actuated Beam

The model performs a static analysis on a piezoelectric actuator based on the movement of a cantilever beam, using the Piezoelectric Devices predefined multiphysics interface. Inspired by work done by V. Piefort and A. Benjeddou, it models a sandwich beam using the shear mode of the piezoelectric material to deflect the tip.

Capacitive Pressure Sensor

A capacitive pressure sensor is simulated. This model shows how to simulate the response of the pressure sensor to an applied pressure, and also how to analyze the effects of packing induced stresses on the sensor performance.

Biased Resonator Models (3D)

An electrostatically actuated MEMS resonator is simulated in the time and frequency domains. The device is driven by an AC + DC bias voltage applied across a parallel plate capacitor. The dependence of the resonant frequency on DC bias is assessed, and frequency domain and transient analyses are performed to investigate the device performance.

Computing Capacitance in a Comb Drive

Capacitive comb drives are commonly used both as actuators and position sensors. The following model focuses on position measurement. Many approaches exist for positional measurements with MEMS devices, of which capacitance measurement is the most widely used, particularly in micro-accelerometers. In a pair of interdigitated combs the fingers of one comb do not touch those of the other comb, ...

SAW Gas Sensor

A surface acoustic wave (SAW) is an acoustic wave propagating along the surface of a solid material. Its amplitude decays rapidly, often exponentially, through the depth of the material. SAWs are utilized in many kinds of electronic components, including filters, oscillators, and sensors. SAW devices typically apply electrodes to a piezoelectric material to convert an electric signal into a ...

Composite Piezoelectric Transducer

This example shows how to set up a piezoelectric transducer problem following the work of Y. Kagawa and T. Yamabuchi. The composite piezoelectric ultrasonic transducer has a cylindrical geometry that consists of a piezoceramic layer, two aluminum layers, and two adhesive layers. The system applies an AC potential on the electrode surfaces of both sides of the piezoceramic layer. The goal is ...

Piezoresistive Pressure Sensor

Piezoresistive pressure sensors were some of the first MEMS devices to be commercialized. Compared to capacitive pressure sensors, they are simpler to integrate with electronics, their response is more linear and they are inherently shielded from RF noise. They do, however, usually require more power during operation and the fundamental noise limits of the sensor are higher than their capacitive ...

Thermal Stresses in a Layered Plate

The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial ...

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