Artigos Técnicos e Apresentações

Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abramgem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

Air Damping Simulation of MEMS Torsional Paddle

N. Mahmoodi[1], C. J. Anthony[1]
[1]University of Birmingham, Birmingham, UK

Viscous damping has a significant effect on dynamic performance of the resonators operating within fluid. This work is aimed to find the viscous damping for MEMS torsional paddle operating in air. Interaction of moving structure with the fluid requires a complicated and challenging analysis. The Fluid-Structure Interaction interface of COMSOL Multiphysics® software is used to study the 2-D ...

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

Fast Biofluid Transport of High Conductive Liquids Using AC Electrothermal Phenomenon, A Study on Substrate Characteristics

A. Salari[1], C. Dalton[1]
[1]University of Calgary, Calgary, AB, Canada

AC electrothermal (ACET) micropumps are based on the temperature gradient caused by Joule heating or an external heat source in the bulk of an electrolyte. In this paper, a 2D simulation was performed to study the effect of substrate thickness and material (glass and silicon) for an ACET micropump configuration. Electric field distribution was obtained assuming coplanar asymmetric ...

Simulation of a Polyimide Based Micromirror

A. Arevalo[1], S. Ilyas[2], D. Conchouso[1], I. G. Foulds[1,3]
[1]Computer, Electrical & Mathematical Sciences & Engineering Division (CEMSE), King Abdullah University of Science & Technology, Thuwal, Saudi Arabia
[2]Physical Sciences & Engineering (PSE), King Abdullah University of Science & Technology, Thuwal, Saudi Arabia
[3]School of Engineering, University of British Columbia - Okanagan, Vancouver, BC, Canada

The simulation of a micromirror using polyimide as the structural material is presented. The simulation was used to verify the initial design parameters and to explore the different characteristics of the electromechanical device. For simulation simplicity the electrodes are integrated as part of the structural layer. The device thickness is 6 μm while the electrodes are 300 nm thick. For the ...

Oxidation of Metallic Nanoparticles

A. Auge[1], A. Weddemann[1], F. Wittbracht[1], B. Vogel[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured via the reduction of the magnetic moment.

Digital Microfluidic Droplet Adapter for Interconnection of Biochips

R. Zhu[1], X. Xiong[2], P. Patra[1], C. Jin[1], J. Hu[3]
[1]Department of Biomedical Engineering, University of Bridgeport, Bridgeport, CT, USA
[2]Department of Electrical & Computer Engineering, University of Bridgeport, Bridgeport, CT, USA
[3]Department of Mechanical Engineering, University of Bridgeport, Bridgeport, CT, USA

In this research, we use the COMSOL Multiphysics® software to design and simulate a digital microfluidic droplet adapter for board-level biochip integration. Digital Microfluidic Biochip (DMFB) has gained tremendous research interest in recent years due to its importance in Lab-on-a-Chip and other bio-MEMS (bio-Microelectromechanical Systems) devices. However, different DMFB microarray from ...

Heat Transfer in Crossflow Heat Exchangers for Application with Microreactors

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

This paper explores methods of improving the heat transfer coefficient in a crossflow heat exchanger as would be employed in conjunction with an experimental or production microreactor. This derivation of the Cross-Flow Heat Exchanger from the COMSOL Multiphysics® software Model Library modifies the substrate geometry by adding two additional layers and uses the material copper in certain ...

Design and Simulation of an Orbiting Piezoelectric MEMS Gyroscope Based on Detection of Phase-Shift Signals

S. Gorelick[1], J. R. Dekker[1], B. Guo[1], H. Rimminen[1]
[1] VTT Technical Research Centre of Finland, Espoo, Finland

The feasibility of phase-sensitive detection of angular-rates using bi-directional orbiting piezoresonators suspended by thick annular springs with thin-film aluminium nitride piezoactuators on top of them was investigated. The ring-shaped flexures are more suitable for supporting the orbiting motion due to their angle-dependent spring constant. The response of the orbiting resonators to angular ...

High Frequency Resonators Using Exotic Nanomaterials

B. Panchapakesan[1], M. Loeian[1]
[1]Department of Mechanical Engineering, Worcester Polytechnic Institute, Worcester, MA, USA

Human made mechanical resonators have been around for a thousand years. Early applications included musical instruments and chronographs operating in millihertz to kilohertz frequencies while more recent interest has turned ultra-high frequency resonators and oscillators suitable for wireless technologies, mass sensing and even biological applications. The trend has been towards small, stiff and ...

Generalized Plane Piezoelectric Problem: Application to Heterostructure Nanowires

H. T. Mengistu[1], A. García-Cristóbal[1]
[1]Material Science Institute, University of Valencia, Valencia, Spain

The possibility to dispose of two-dimensional (2D) approaches to problems originally posed in a three-dimensional (3D) geometry is always desirable since it reduces significantly the computing resources needed for numerical studies. In this work we report on a new 2D approach called Generalized Plane Piezoelectric (GPP) problem [1] and apply it to the calculation of the strain and electric fields ...

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