Artigos Técnicos e Apresentações

Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abramgem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

Multiscale Model of Human Pathogen Growth on Fresh Produce

A. Warning[1], A. K. Datta[1]
[1]Department of Biological & Environmental Engineering, Cornell University, Ithaca, NY, USA

Predictive food microbiology currently first requires experimental data for growth on fresh produce and then fitting an empirical or semi-empirical model to the data, making extrapolation to other conditions (temperature, type of produce) difficult. Herein, we develop a mechanistic model for the growth of human pathogenic bacteria (Escherichia coli O157:H7 and Salmonella spp.) on spinach using ...

Boundary Value Effects on Migration Patterns in Hydraulically Fractured Shale Formations

T. Aseeperi[1]
[1]Department of Chemical Engineering, University of Arkansas, Fayetteville, AR, USA

During the hydraulic fracturing process, there can be possible re-activation of closed/sealed faults and natural fractures in the formation, which may lead to changes in the boundary conditions of the reservoir. While study models of shale gas formations have utilized the concept of a closed reservoir in order to optimize the production of gas in the well-bore, this assumption cannot be adopted ...

A Computational Study on Thermal Conductivity Measurements of High Temperature Liquid Materials

X. Ye[1], R. W. Hyers[1]
[1]Department of Mechanical & Industrial Engineering, University of Massachusetts - Amherst, Amherst, MA, USA

Accurate thermo-physical properties of materials are valuable for both scientific research and industrial applications. For high temperature liquid materials, two issues exclude traditional methods: elevated reactivity of test material and experimental apparatus, uncontrolled heat transfer through radiation and convection. Electromagetic Levitation (EML) based Modulated Calorimetry (EML-MC) ...

Finite Element Modeling of Conventional and Pulsed Eddy Current Probes for CANDU® Fuel Channel Inspection

M. Luloff[1], J. Morelli[1], T. W. Krause[2]
[1]Department of Physics, Engineering Physics & Astronomy, Queen's University, Kingston, ON, Canada
[2]Department of Physics, Royal Military College of Canada, Kingston, ON, Canada

A pulsed Eddy Current (EC) probe, using the transient response to a stepped voltage is being developed for in-reactor inspection of CANDU® fuel channels. Pulsed EC has the advantage of generating a spectrum of discrete frequencies, allowing the simultaneous collection of data from a range of depths (i.e. takes advantage of multiple skin depths) that is unachievable by conventional EC, which ...

Frequency Response Modeling of Inductive Position Sensor with Finite Element Tools

A. K. Palit[1]
[1]LE GmbH, Espelkamp, Germany

Position sensors have several applications in the automotive sector. Some of the common examples include automatic gear shifter module, seat position adjustment and accelerator-pedal position modules etc. Because of extreme weather condition, such as dust, humidity and moisture and fluctuation of temperature and wide operating temperature range. A non-contact type of inductive position sensor has ...

Application of a Weakly Non-Linear Analysis to the Analysis of Thermoacoustic Combustion Instabilities

D. Laera[1], S. M. Camporeale[1], G. Campa[2]
[1]Politecnico di Bari, Bari, Italy
[2]Ansaldo Energia, Genoa, Italy

The thermoacoustic combustion instabilities are complex phenomena that may occur in steady flow combustion systems that are aboard of, e.g., rocket engines or gas turbines. The phenomena involve the interaction of chemical reactions with fluid-dynamic and propagation of pressure waves in the combustion chamber. Combustion instabilities may lead to a stable condition (known as “limit-cycle”) ...

Modeling the Human Touch: A FEM Model of the Human Hand Fingertips for Haptic Applications

A. Talarico[1], M. Malvezzi[1], D. Prattichizzo[1,2]
[1]Department of Information Engineering & Mathematical Science, University of Siena, Siena, Italy
[2]Istituto Italiano di Tecnologia, Genova, Italy

Performance of tactile sensation is affected by fingertip deformation characteristics produced when touching objects. Tactile performance of human fingertips is strictly associated with activity of the nerve endings and sensitivity of the soft tissue within the fingertip to the static and dynamic skin indentation. In this study, a Finite Element model, based on the physiological structure of ...

Electromagnetic Actuators Modeling, Simulation and Optimization: Review of Methods and Their Application for Switching Devices

O. Craciun[1], V. Biagini[1], G. Stengel[1], C. Reuber[2], C. Chao[3], B. Funieru[3] , A. Binder[3]
[1]ABB Corporate Research, Ladenburg, Germany
[2]ABB AG Calor Emag Mittelspannungsprodukte
[3]TU Darmstadt, Department of Electrical Energy Conversion, Darmstadt, Germany

Electromagnetic actuators are representing one important component of ABB's medium voltage reclosers [1, 2]. Their performance is strongly influenced by the considered material properties as well as by the electronic control units that will power the actuator. Depending on the studied phenomena, different modeling, simulation and optimization methodologies are being used for medium voltage ...

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a polycrystalline tungsten tip via electric-field assisted tunneling. In order to characterize and improve the capabilities ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

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